Four core product series — Si₃N₄ and ZrO₂ precision ceramics for power electronics, fine grinding, high-temperature metallurgy, and high-end equipment.
Si₃N₄ ceramic substrates offer a unique combination of high thermal conductivity, high flexural strength, and high fracture toughness — ideal for IGBT/SiC power module packaging. Superior electrical insulation and CTE matching enhance device reliability and lifetime.
| Material | Si₃N₄ |
| Thermal Conductivity | 80 W/m·K |
| Fracture Toughness | 6.7-8 MPa·m½ |
| Flexural Strength | 650 MPa |
| Resistivity | 10¹³ Ohm·cm |
| Dielectric Constant | 4.0±10% |
High-wear-resistant Si₃N₄/ZrO₂ ceramic micro beads manufactured via isostatic pressing. Extremely low media wear with grinding efficiency far exceeding traditional alumina balls and glass beads. Ideal for lithium battery materials, electronic pastes, and mineral ultrafine grinding.
| Material | Si₃N₄ / ZrO₂ |
| Diameter | 0.1-2.0mm |
| Density | 3.2-6.0 g/cm³ |
| Relative Density | >99% |
| Hardness | >1300 kgf/mm² |
| Elastic Modulus | 210-310 GPa |
High-purity Si₃N₄ grinding jars and crucibles manufactured using advanced forming and sintering processes. Excellent wear resistance for planetary ball mills and high-temperature performance for precious metal smelting and special alloy casting.
| Material | Si₃N₄ |
| Purity | ≥99.5% |
| Density | 3.2 g/cm³ |
| Max Temperature | ≤1650℃ |
| Strength | 600-1000 MPa |
| Hardness | >1580 kgf/mm² |
Precision Si₃N₄/ZrO₂ ceramic structural components including bearing rings, bushings, insulating rings, seals, nozzles, and custom shapes. Advanced forming and machining processes ensure reliable operation in high-speed, high-temperature, and corrosive environments.
| Material | Si₃N₄ / ZrO₂ |
| Density | 3.2-6.0 |
| Strength | 600-1200 MPa |
| Hardness | >1300 |
| Toughness | >7 MPa·m½ |
| Max Temp | ≤1650℃ |
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